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About UsEstablished in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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TechnicalThe company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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SolutionsDraking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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DRAKING
SEMI
Since
Company Profile
Committed to becoming a leading domestic substitute for packaging and grinding consumables
Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies. We master core technologies and processes, providing customers with a complete cutting and grinding solution of "consumables + equipment" for "dicing + grinding" in the semiconductor packaging process.
The company conducted 3 years of product research and development and equipment development in Japan, and is currently mass-producing and selling Electroformed Bond Hub Blades, Hubless Blades, and Dressing Board, which can be used for IGBT chips, Sic chips, tantalum/niobate lithium chips, integrated circuit IC chips, double-layer bonded chips, QFN, DFN and other packages, ceramic and glass substrates.
The company has also built a wafer grinding and polishing plant of considerable scale. All equipment uses DISCO and TSK automatic machines, and has the capability of processing 12-inch wafers, providing customers with grinding and polishing services.
Corporate Culture
Upholding the cultural concept of "pursuing excellence, creating brilliance", we are customer-oriented, constantly innovating, and committed to providing customers with high-quality products and services
Internal
Innovation, excellence, teamwork, and sustainable development.
External
Honesty, intimate service, mutual benefit and win-win, and common growth.
Qualifications and Honors
We are a Jiangsu Province high-tech small and medium-sized enterprise with a leading technology team and advanced production equipment, and have passed ISO 9001 quality management system certification, and have core patents, software copyrights, and a large number of proprietary technologies. Our products comply with international standards and have been recognized by well-known customers in the industry.

ISO 9001 Quality Management System Certification

Technology-based small and medium-sized enterprises

A thin blade diamond grinding wheel

A device for detecting the concentration of diamond powder
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Telephone
Ms. Chen +86-19946171465
Mr. Wang +86-19101627797
Address
Building 2, Jinhui Technology Park, No. 3119, Mudanjiang West Road, Qidong City, Jiangsu Province, China.